From Sand to Silicon : The Making of a Microchip | Intel

From Sand to Silicon : The Making of a Microchip | Intel

On July 18, 1968 a revolutionary tech was made that changed the world in the field of communications and computing.The world is producing data at a remarkable rate faster than our ability to analyze and understand it to move store and compute all of this data requires incredible processing power from the blazing speeds of our devices to blazing trails within AI intel builds chips that are at the heart of nearly everything within every intel chip manufacturing facility across the globe innovators are pushing limits of science and literally rearranging atoms to create groundbreaking technology this strong silicon foundation is what gives each intel chip limitless potential at the heart of all modern

electronics the transistor is a tiny switch 10,000 times smaller than a human hair that controls the flow of electrons through a circuit to

to build a processor billions of transistors are packed into an area 

no larger than a fingernail it's one of mankind's most complex feats and a remarkable achievements that intel has essentially doubled transistor density in every new generation of processors

the process begins when silicon rich sand is melted and cooled forming a solid which is then sliced into wafers once inside an 

intel fab the raw wafers begin their long journey through an incredibly complex process they're loaded into front opening unified pods or foods which travel hundreds of miles along intel's

automated superhighway going from tool to tool as processors are painstakingly built up on each wafer the wafer first goes through a series of important steps such as photolithography ion implantation

and etching that prepare it for critical transistor formation process intel was first to introduce three-dimensional transistors called FinFETs FinFET

after more than a thousand of these complex steps the wafers are finally prepared for singular and packaging innovative processor packaging has become a critical feature of advanced computing

architecture 2d and 3d packaging technologiesare enabling new devices form factors and additional boosts in performance and energy efficiency testing of final product ensures that every chip exceeds our performance and quality standards in addition more performance

and features with each new processor generation  intel's integrated designs and performance of every chip.